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Published 18:53 IST, April 2nd 2024

Japan announces $3.9 billion subsidy for chip foundry venture Rapidus

The newly sanctioned funding encompasses 53.5 billion yen earmarked for advanced packaging, a crucial element in enhancing chip performance.

Reported by: Business Desk
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Semiconductors
Semiconductors | Image: Unsplash
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18:53 IST, April 2nd 2024