Published 18:53 IST, April 2nd 2024
Japan announces $3.9 billion subsidy for chip foundry venture Rapidus
The newly sanctioned funding encompasses 53.5 billion yen earmarked for advanced packaging, a crucial element in enhancing chip performance.
![Semiconductors](https://img.republicworld.com/tr:w-800,h-450,q-75,f-auto/rimages/vishnu-mohanan-Z7lkMJv0Zd4-unsplash-170115892606016_9.webp)
Semiconductors | Image:
Unsplash
- Listen to this article
- 1 min read
Advertisement
18:53 IST, April 2nd 2024